Maskless direct write lithography for 3D wafer-level-system-integration
نویسندگان
چکیده
This publication presents lithography results for 3D wafer-level system integration applications using a reticle free maskless VPG+ 400 from Heidelberg Instruments. The focus is on high density Cu redistribution layer (RDL) formation with <2µm L/S used in polymer RDL stacks, overlay accuracy determination better than ±150nm and hybrid bond interconnect 2µm interconnects, all processed 300mm wafer size substrates.
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ژورنال
عنوان ژورنال: IMAPS symposia and conferences
سال: 2023
ISSN: ['2380-4505']
DOI: https://doi.org/10.4071/001c.74634